منابع مشابه
Diamond thin films: a 21st-century material
Diamond has some of the most extreme physical properties of any material, yet its practical use in science or engineering has been limited due its scarcity and expense. With the recent development of techniques for depositing thin films of diamond on a variety of substrate materials, we now have the ability to exploit these superlative properties in many new and exciting applications. In this p...
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Mechanical Properties of Ultrananocrystalline Diamond Thin Films for MEMS Applications
Microcantilever deflection and the membrane deflection experiment (MDE) were used to examine the elastic and fracture properties of ultrananocrystalline diamond (UNCD) thin films in relation to their application to microelectromechanical systems (MEMS). Freestanding microcantilevers and membranes were fabricated using standard MEMS fabrication techniques adapted to our UNCD film technology. Ela...
متن کاملUltrananocrystalline and Nanocrystalline Diamond Thin Films for MEMS/NEMS Applications
Anirudha V. Sumant, Orlando Auciello, Robert W. Carpick, Sudarsan Srinivasan, and James E. Butler of smooth diamond films with uniform thickness and micro/nanostructure over large area substrates (≥150 mm diameter wafer), as recently demonstrated.1 Growth of thin (0.1 to 5 micron thick) diamond films on nondiamond substrates, typically conventional electronic substrates such as Si, SiC, and AlN...
متن کاملNanocrystalline Diamond Thin Films for MEMS and Biomedical Devices
The main aim of the NIRT project is to synthesize, characterize and model the nanocrystalline diamond thin films to utilize its extraordinary properties in various applications such as biomedical devices, MEMS structures and RF-MEMS devices. The research focus is in the following areas: (i) Synthesis and Processing of Nanocrystalline Diamond Films by Microwave Plasma Enhanced CVD: The primary o...
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ژورنال
عنوان ژورنال: Journal of the Illuminating Engineering Institute of Japan
سال: 1999
ISSN: 0019-2341,1349-838X,2185-1506
DOI: 10.2150/jieij1980.83.7_464